www.ti.com
15-Oct-2009
PACKAGINGINFORMATION
OrderableDevice5962-91001Q2A5962-91001QEA5962-91001QFAAM26C32CDAM26C32CDBLEAM26C32CDE4AM26C32CDG4AM26C32CDRAM26C32CDRE4AM26C32CDRG4AM26C32CNAM26C32CNE4AM26C32CNSRAM26C32CNSRE4AM26C32CNSRG4
AM26C32IDAM26C32IDBLEAM26C32IDE4AM26C32IDG4AM26C32IDRAM26C32IDRE4AM26C32IDRG4AM26C32INAM26C32INE4AM26C32INSRAM26C32INSRE4AM26C32INSRG4
Status(1)ACTIVEACTIVEACTIVEACTIVEOBSOLETEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEOBSOLETEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVE
PackageTypeLCCCCDIPCFPSOICSSOPSOICSOICSOICSOICSOICPDIPPDIPSOSOSOSOICSSOPSOICSOICSOICSOICSOICPDIPPDIPSOSOSO
PackageDrawingFKJWDDBDDDDDNNNSNSNSDDBDDDDDNNNSNSNS
PinsPackageEcoPlan(2)
Qty201616161616161616161616161616161616161616161616161616
4040404011140
TBDTBDTBDGreen(RoHS&noSb/Br)
TBDGreen(RoHS&noSb/Br)Green(RoHS&noSb/Br)
Lead/BallFinish
MSLPeakTemp(3)
POST-PLATEN/AforPkgType
A42A42CUNIPDAUCallTICUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCallTICUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAU
N/AforPkgTypeN/AforPkgTypeLevel-1-260C-UNLIMCallTI
Level-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMN/AforPkgTypeN/AforPkgTypeLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMCallTI
Level-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMN/AforPkgTypeN/AforPkgTypeLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIM
2500Green(RoHS&
noSb/Br)2500Green(RoHS&
noSb/Br)2500Green(RoHS&
noSb/Br)2525
Pb-Free(RoHS)Pb-Free(RoHS)
2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)40
Green(RoHS&noSb/Br)
TBDGreen(RoHS&noSb/Br)Green(RoHS&noSb/Br)
2500Green(RoHS&
noSb/Br)2500Green(RoHS&
noSb/Br)2500Green(RoHS&
noSb/Br)2525
Pb-Free(RoHS)Pb-Free(RoHS)
2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)
Addendum-Page1
PACKAGEOPTIONADDENDUM
www.ti.com
15-Oct-2009
OrderableDeviceAM26C32IPWAM26C32IPWE4AM26C32IPWG4AM26C32IPWRAM26C32IPWRG4AM26C32MFKBAM26C32MJBAM26C32MWBAM26C32QDAM26C32QDG4
(1)
Status(1)ACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVE
PackageTypeTSSOPTSSOPTSSOPTSSOPTSSOPLCCCCDIPCFPSOICSOIC
PackageDrawingPWPWPWPWPWFKJWDD
PinsPackageEcoPlan(2)
Qty16161616162016161616
909090
Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)
Lead/BallFinishCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAU
MSLPeakTemp(3)Level-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIM
2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)1114040
TBDTBDTBDTBDGreen(RoHS&noSb/Br)
POST-PLATEN/AforPkgType
A42A42CUNIPDAUCUNIPDAU
N/AforPkgTypeN/AforPkgTypeLevel-1-220C-UNLIMLevel-1-260C-UNLIM
Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.
LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.
NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.
PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable.OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.
(2)
EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheckhttp://www.ti.com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.
Pb-Free(RoHS):TI'sterms\"Lead-Free\"or\"Pb-Free\"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.
Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.ThecomponentisotherwiseconsideredPb-Free(RoHScompatible)asdefinedabove.
Green(RoHS&noSb/Br):TIdefines\"Green\"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial)
(3)
MSL,PeakTemp.--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.
ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.Effortsareunderwaytobetterintegrateinformationfromthirdparties.TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysisonincomingmaterialsandchemicals.TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.
InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.
OTHERQUALIFIEDVERSIONSOFAM26C32,AM26C32M:•EnhancedProduct:AM26C32-EP
NOTE:QualifiedVersionDefinitions:
•EnhancedProduct-SupportsDefense,AerospaceandMedicalApplications
Addendum-Page2
PACKAGEMATERIALSINFORMATION
www.ti.com
30-Jul-2010
TAPEANDREELINFORMATION
*Alldimensionsarenominal
Device
PackagePackagePinsTypeDrawingSOICSOSOICSOTSSOP
DNSDNSPW
1616161616
SPQ
ReelReelA0DiameterWidth(mm)(mm)W1(mm)330.0330.0330.0330.0330.0
16.416.416.416.412.4
6.58.26.58.26.9
B0(mm)10.310.510.310.55.6
K0(mm)2.12.52.12.51.6
P1(mm)8.012.08.012.08.0
WPin1(mm)Quadrant16.016.016.016.012.0
Q1Q1Q1Q1Q1
AM26C32CDRAM26C32CNSRAM26C32IDRAM26C32INSRAM26C32IPWR
25002000250020002000
PackMaterials-Page1
PACKAGEMATERIALSINFORMATION
www.ti.com
30-Jul-2010
*Alldimensionsarenominal
DeviceAM26C32CDRAM26C32CNSRAM26C32IDRAM26C32INSRAM26C32IPWR
PackageType
SOICSOSOICSOTSSOP
PackageDrawing
DNSDNSPW
Pins1616161616
SPQ25002000250020002000
Length(mm)
333.2346.0333.2346.0346.0
Width(mm)345.9346.0345.9346.0346.0
Height(mm)
28.633.028.633.029.0
PackMaterials-Page2
MECHANICAL DATA MLCC006B – OCTOBER 1996FK (S-CQCC-N**) 28 TERMINAL SHOWNLEADLESS CERAMIC CHIP CARRIER18171615141312NO. OFTERMINALS**1110287668584445220AMIN0.342(8,69)0.442(11,23)0.0(16,26)0.739(18,78)0.938(23,83)1.141(28,99)MAX0.358(9,09)0.458(11,63)0.660(16,76)0.761(19,32)0.962(24,43)1.165(29,59)MIN0.307(7,80)0.406(10,31)0.495(12,58)0.495(12,58)0.850(21,6)1.047(26,6)BMAX0.358(9,09)0.458(11,63)0.560(14,22)0.560(14,22)0.858(21,8)1.063(27,0)192021B SQ22A SQ23242526272812340.080 (2,03)0.0 (1,63)0.020 (0,51)0.010 (0,25)0.020 (0,51)0.010 (0,25)0.055 (1,40)0.045 (1,14)0.045 (1,14)0.035 (0,)0.028 (0,71)0.022 (0,54)0.050 (1,27)0.045 (1,14)0.035 (0,)4040140/D 10/96NOTES:A.B.C.D.E.All linear dimensions are in inches (millimeters).This drawing is subject to change without notice.This package can be hermetically sealed with a metal lid.The terminals are gold plated.Falls within JEDEC MS-004POST OFFICE BOX 655303 DALLAS, TEXAS 75265•MECHANICAL DATAMSSO002E – JANUARY 1995 – REVISED DECEMBER 2001DB (R-PDSO-G**) 28 PINS SHOWN0,65280,380,22150,15MPLASTIC SMALL-OUTLINE0,250,095,605,008,207,40Gage Plane1A140°–ā8°0,250,950,55Seating Plane2,00 MAX0,05 MIN0,10PINS **DIMA MAX146,50166,50207,50248,502810,503010,503812,90A MIN5,905,906,907,909,909,9012,304040065/E 12/01NOTES:A.B.C.D.All linear dimensions are in millimeters.This drawing is subject to change without notice.Body dimensions do not include mold flash or protrusion not to exceed 0,15.Falls within JEDEC MO-150POST OFFICE BOX 655303 DALLAS, TEXAS 75265• MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 MECHANICAL DATA PW (R-PDSO-G**) 14 PINS SHOWNPLASTIC SMALL-OUTLINE PACKAGE0,651480,300,190,10M0,15 NOM4,504,306,606,20Gage Plane0,251A70°–8°0,750,50Seating Plane1,20 MAX0,150,050,10PINS **DIMA MAX83,10145,10165,10206,60247,902,80A MIN2,904,904,906,407,709,6040400/F 01/97NOTES:A.B.C.D.All linear dimensions are in millimeters.This drawing is subject to change without notice.Body dimensions do not include mold flash or protrusion not to exceed 0,15.Falls within JEDEC MO-153POST OFFICE BOX 655303 DALLAS, TEXAS 75265•IMPORTANTNOTICE
TexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,modifications,enhancements,improvements,andotherchangestoitsproductsandservicesatanytimeandtodiscontinueanyproductorservicewithoutnotice.Customersshouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentandcomplete.AllproductsaresoldsubjecttoTI’stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment.
TIwarrantsperformanceofitshardwareproductstothespecificationsapplicableatthetimeofsaleinaccordancewithTI’sstandardwarranty.TestingandotherqualitycontroltechniquesareusedtotheextentTIdeemsnecessarytosupportthiswarranty.Exceptwheremandatedbygovernmentrequirements,testingofallparametersofeachproductisnotnecessarilyperformed.
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TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanyTIpatentright,copyright,maskworkright,orotherTIintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIproductsorservicesareused.InformationpublishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensefromTItousesuchproductsorservicesorawarrantyorendorsementthereof.Useofsuchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectualpropertyofthethirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI.
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FollowingareURLswhereyoucanobtaininformationonotherTexasInstrumentsproductsandapplicationsolutions:ProductsAmplifiersDataConvertersDLP®ProductsDSP
ClocksandTimersInterfaceLogicPowerMgmtMicrocontrollersRFID
amplifier.ti.comdataconverter.ti.comwww.dlp.comdsp.ti.comwww.ti.com/clocksinterface.ti.comlogic.ti.compower.ti.commicrocontroller.ti.comwww.ti-rfid.com
ApplicationsAudioAutomotive
CommunicationsandTelecomComputersandPeripherals
ConsumerElectronicsEnergyIndustrialMedicalSecurity
Space,Avionics&Defense
VideoandImagingWireless
www.ti.com/audiowww.ti.com/automotivewww.ti.com/communicationswww.ti.com/computerswww.ti.com/consumer-appswww.ti.com/energywww.ti.com/industrialwww.ti.com/medicalwww.ti.com/security
www.ti.com/space-avionics-defensewww.ti.com/videowww.ti.com/wireless-apps
RF/IFandZigBee®Solutionswww.ti.com/lprf
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