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专利名称：Electropolishing pad
发明人：Steven E. Reder,Michael J. Berman申请号：US10693142申请日：20031024
公开号：US20050087450A1公开日：20050428
专利附图：
摘要：An electropolishing pad adapted for thinning a layer on a substrate, withoutdamaging a delicate underlying layer in the substrate. The electropolishing pad includesa pad formed of an electrically conductive material, for applying a desired voltagepotential through the electropolishing pad to electrolytically erode the layer on the
substrate. An operating surface on the pad physically erodes the layer on the substrate.The operating surface has a roughness that is not so great as to create friction sufficientto induce a shearing force that damages the delicate underlying layer in the substrate,but great enough so as to physically erode the layer on the substrate.
申请人：Steven E. Reder,Michael J. Berman
地址：Boring OR US,West Linn OR US
国籍：US,US
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