专利内容由知识产权出版社提供
专利名称：PACKAGE SUBSTRATE FOR OPTICAL
ELEMENT AND METHOD OFMANUFACTURING THE SAME
发明人：Ji Hyun PARK,Seog Moon CHOI,Tae Hoon
KIM,Sang Hyun SHIN,Tae Hyun KIM
申请号：US14145514申请日：20131231
公开号：US20140113392A1公开日：20140424
专利附图：
摘要：Disclosed herein is a method of manufacturing a package substrate for opticalelements. The method includes the steps of providing a conductive substrate includingan insulation layer formed thereon, and forming a circuit layer and electrode pads on theconductive substrate using a plating process. The method further includes selectivelyplating the circuit layer, in which the optical element is to be mounted, with a conductorto such a thickness that the optical element is buried, forming a cavity space including alower part and a side wall in the circuit layer, and mounting an optical element in thecavity space and then applying a fluorescent resin layer thereon.
申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.
地址：Gyunggi-do KR
国籍：KR
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