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专利名称：Method and compositions for producing
copper surfaces for improved bonding andarticles made therefrom
发明人：Bishop, Craig V.,Bokisa, George S.,Durante,
Robert J.,Kochilla, John R.
申请号：EP98310366.4申请日：19981217公开号：EP0926265B1公开日：20021113
摘要：This invention relates to a method of forming a substrate with preparing asurface capable of making a cocontinuous bond comprising the steps of 1) obtaining acopper or copper alloy substrate and 2) applying an etching composition whichcomprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) acopper complex, wherein the copper complex is present in an amount which precipitateswhen applied to the copper or copper alloy substrate. The method also includes thestep of 3) treating the substrate with a coating composition and/or 4) applying astripping composition to the substrate. The invention also relates to copper articles,having surface porosity, including multilayer articles such as printed circuit boards andcompositions used in the method. The present invention provides microporous copper orcopper alloy substrates which have improved adhesion properties to organic material.
申请人：ATOTECH DEUTSCHLAND GMBH
地址：DE
国籍：DE
代理机构：Crisp, David Norman
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