www.ti.com
6-May-2009
PACKAGINGINFORMATION
OrderableDeviceUC2638DWUC2638DWG4UC2638DWTRUC2638DWTRG4
UC2638NUC2638NG4UC3638DWUC3638DWG4UC3638DWTRUC3638DWTRG4
UC3638NUC3638NG4UC3638QUC3638QG3
(1)
Status(1)NRNDNRNDNRNDNRNDNRNDNRNDACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVE
PackageTypeSOICSOICSOICSOICPDIPPDIPSOICSOICSOICSOICPDIPPDIPPLCCPLCC
PackageDrawingDWDWDWDWNNDWDWDWDWNNFNFN
PinsPackageEcoPlan(2)
Qty2020202020202020202020202020
2525
Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)
Lead/BallFinishCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUSNCUSN
MSLPeakTemp(3)Level-2-260C-1YEARLevel-2-260C-1YEARLevel-2-260C-1YEARLevel-2-260C-1YEARN/AforPkgTypeN/AforPkgTypeLevel-2-260C-1YEARLevel-2-260C-1YEARLevel-2-260C-1YEARLevel-2-260C-1YEARN/AforPkgTypeN/AforPkgTypeLevel-2-260C-1YEARLevel-2-260C-1YEAR
2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)20202525
Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)
2000Green(RoHS&
noSb/Br)2000Green(RoHS&
noSb/Br)202046
Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)
Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.
LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.
NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.
PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable.OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.
(2)
EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheckhttp://www.ti.com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.
Pb-Free(RoHS):TI'sterms\"Lead-Free\"or\"Pb-Free\"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.
Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.ThecomponentisotherwiseconsideredPb-Free(RoHScompatible)asdefinedabove.
Green(RoHS&noSb/Br):TIdefines\"Green\"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial)
(3)
MSL,PeakTemp.--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.
ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitis
Addendum-Page1
PACKAGEOPTIONADDENDUM
www.ti.com
6-May-2009
provided.TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.Effortsareunderwaytobetterintegrateinformationfromthirdparties.TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysisonincomingmaterialsandchemicals.TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.
InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.
OTHERQUALIFIEDVERSIONSOFUC3638:•Military:UC1638
NOTE:QualifiedVersionDefinitions:
•Military-QMLcertifiedforMilitaryandDefenseApplications
Addendum-Page2
PACKAGEMATERIALSINFORMATION
www.ti.com
21-Apr-2009
TAPEANDREELINFORMATION
*Alldimensionsarenominal
Device
PackagePackagePinsTypeDrawingSOICSOIC
DWDW
2020
SPQ
ReelReelDiameterWidth(mm)W1(mm)330.0330.0
24.424.4
A0(mm)B0(mm)K0(mm)
P1(mm)12.012.0
WPin1(mm)Quadrant24.024.0
Q1Q1
UC2638DWTRUC3638DWTR
20002000
10.810.8
13.013.0
2.72.7
PackMaterials-Page1
PACKAGEMATERIALSINFORMATION
www.ti.com
21-Apr-2009
*Alldimensionsarenominal
DeviceUC2638DWTRUC3638DWTR
PackageType
SOICSOIC
PackageDrawing
DWDW
Pins2020
SPQ20002000
Length(mm)
346.0346.0
Width(mm)346.0346.0
Height(mm)
41.041.0
PackMaterials-Page2
MECHANICAL DATA MPLC004A – OCTOBER 1994FN (S-PQCC-J**) 20 PIN SHOWNPLASTIC J-LEADED CHIP CARRIERSeating Plane0.004 (0,10)DD131190.032 (0,81)0.026 (0,66)418D2/E20.180 (4,57) MAX0.120 (3,05)0.090 (2,29)0.020 (0,51) MINEE1D2/E28149130.050 (1,27)0.008 (0,20) NOM0.021 (0,53)0.013 (0,33)0.007 (0,18)MNO. OFPINS**202844526884D/EMIN0.385 (9,78)0.485 (12,32)0.685 (17,40)0.785 (19,94)0.985 (25,02)1.185 (30,10)MAX0.395 (10,03)0.495 (12,57)0.695 (17,65)0.795 (20,19)0.995 (25,27)1.195 (30,35)MIND1/E1MAX0.356 (9,04)0.456 (11,58)0.656 (16,66)0.756 (19,20)0.958 (24,33)1.158 (29,41)MIND2/E2MAX0.169 (4,29)0.219 (5,56)0.319 (8,10)0.369 (9,37)0.469 (11,91)0.569 (14,45)4040005/B 03/950.350 (8,)0.450 (11,43)0.650 (16,51)0.750 (19,05)0.950 (24,13)1.150 (29,21)0.141 (3,58)0.191 (4,85)0.291 (7,39)0.341 (8,66)0.441 (11,20)0.541 (13,74)NOTES:A.All linear dimensions are in inches (millimeters).B.This drawing is subject to change without notice.C.Falls within JEDEC MS-018POST OFFICE BOX 655303 DALLAS, TEXAS 75265•1IMPORTANTNOTICE
TexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,modifications,enhancements,improvements,andotherchangestoitsproductsandservicesatanytimeandtodiscontinueanyproductorservicewithoutnotice.Customersshouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentandcomplete.AllproductsaresoldsubjecttoTI’stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment.
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TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanyTIpatentright,copyright,maskworkright,orotherTIintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIproductsorservicesareused.InformationpublishedbyTIregardingthird-partyproductsorservicesdoesnotconstitutealicensefromTItousesuchproductsorservicesorawarrantyorendorsementthereof.Useofsuchinformationmayrequirealicensefromathirdpartyunderthepatentsorotherintellectualpropertyofthethirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI.
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acknowledgeandagreethattheyaresolelyresponsibleforalllegal,regulatoryandsafety-relatedrequirementsconcerningtheirproductsandanyuseofTIproductsinsuchsafety-criticalapplications,notwithstandinganyapplications-relatedinformationorsupportthatmaybeprovidedbyTI.Further,BuyersmustfullyindemnifyTIanditsrepresentativesagainstanydamagesarisingoutoftheuseofTIproductsinsuchsafety-criticalapplications.
TIproductsareneitherdesignednorintendedforuseinmilitary/aerospaceapplicationsorenvironmentsunlesstheTIproductsarespecificallydesignatedbyTIasmilitary-gradeor\"enhancedplastic.\"OnlyproductsdesignatedbyTIasmilitary-grademeetmilitary
specifications.BuyersacknowledgeandagreethatanysuchuseofTIproductswhichTIhasnotdesignatedasmilitary-gradeissolelyattheBuyer'srisk,andthattheyaresolelyresponsibleforcompliancewithalllegalandregulatoryrequirementsinconnectionwithsuchuse.TIproductsareneitherdesignednorintendedforuseinautomotiveapplicationsorenvironmentsunlessthespecificTIproductsaredesignatedbyTIascompliantwithISO/TS16949requirements.Buyersacknowledgeandagreethat,iftheyuseanynon-designatedproductsinautomotiveapplications,TIwillnotberesponsibleforanyfailuretomeetsuchrequirements.
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