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专利名称：CONDUCTIVE PASTE COMPOSITION,
CONDUCTIVE STRUCTURE AND METHODOF PRODUCING THE SAME
发明人：Shu-Ching YANG,Janet TSAO申请号：US15058170申请日：20160302
公开号：US20160340519A1公开日：20161124
摘要：A conductive paste composition is provided, and has a copper-containingconductive powder, an adhesive alloy powder selected from tin-based, bismuth-based,indium-based or zinc-based material, and an organic carrier. The organic carrier is 5-35%by weight of the conductive paste composition. Moreover, a method of producing aconductive structure is provided, and has steps of: applying the conductive pastecomposition onto the substrate to form a conductive pattern; heating the conductivepattern; and cooling the conductive pattern to obtain the conductive structure. Theconductive pattern has a plurality of copper-containing conductive particles and anadhesive alloy. At least one part of the copper-containing conductive particles connectswith each other through the adhesive alloy, and the copper-containing conductiveparticles are connected with the substrate by the adhesive alloy.
申请人：CHUAN HSI RESEARCH CO., LTD.
地址：Pingtung TW
国籍：TW
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