专利内容由知识产权出版社提供
专利名称：Chip on board package with top and bottom
terminals
发明人：Stephen J. Thomas申请号：US08/254143申请日：19940606公开号：US05828126A公开日：19981027
摘要：An integrated circuit package of this invention includes a series of
nonconductive rigid substrates, each substrate having a pattern of generally coplanarbond fingers embedded thereupon. An integrated circuit die is connected to individualbond fingers of varying bond finger patterns. Individual bond fingers are connected topackage terminals by medial leads, which are generally perpendicular to the bond fingerpatterns. Semiconductor die packages having both top and bottom package terminalsare thus produced. Methods and devices are shown.
申请人：VLSI TECHNOLOGY, INC.
代理机构：Wagner, Murabito & Hao
更多信息请下载全文后查看
